In November 2025, Navitas and GF announced a long-term strategic partnership to accelerate U.S. GaN innovation and domestic manufacturing.

Kulicke and Soffa Industries, Inc. continues to strengthen its position as a critical enabler of next-generation artificial intelligence (AI) infrastructure through its advanced packaging portfolio.

Drawing on decades of expertise in advanced packaging, heterogeneous integration and photonics manufacturing, EVG supports multiple stages of the CPO manufacturing value chain.

Teradyne, Inc., a provider of automated test equipment and advanced robotics, announced the launch of three new instruments for its UltraFLEXplus platform, designed to meet the increasingly complex ...

The next generation of microelectronics relies on radical improvements in transistor switching performance to advance ...

A wafer-scale 2D semiconductor combines high hole mobility, strong stability and transistor performance, advancing next-generation CMOS electronics.

The Rigaku Group will exhibit at “SEMICON Taiwan 2026,” taking place September 2 to 4, 2026, at TaiNEX 1 and 2 in Taipei.

As AI applications continue to proliferate, demand for high-performance computing and high-speed data transmission is accelerating, making AI infrastructure capacity a critical enabler of industry ...

Qnity Electronics, Inc., a technology solutions leader across the semiconductor value chain, has further expanded its offerings for advanced packaging with the introduction of the Stackplane family of ...

Trymax Semiconductor Equipment today announced that it has been awarded a substantial, multi-year, multi-million-dollar purchase order by Applied Optoelectronics, Inc.