IC ecosystem; UPF 4.0; AI readiness; auto, industrial chiplet SW; PCIe 6; 3D thermal analysis; rad-hard simulation.

Controlling film thickness to precise specifications is essential for ensuring high yield in high-performance devices.

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

With each iteration, PCIe has not only increased data bandwidth but also introduced innovations aimed at enhancing power efficiency—a critical factor in today’s energy-conscious computing environment.

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...