Artificial intelligence is creating a growing memory bottleneck, with Bernstein analysts saying demand is spreading beyond high-bandwidth memory into conventional DRAM, NAND flash and storage.

Samsung Electronics and SK Hynix used this year’s Future of Memory and Storage conference in Santa Clara to lay out competing answers to a problem that has quietly become the biggest constraint on ...

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The AI Stack Model splits the AI trade into 14 segments across 4 layers, scoring each on macro conditions, estimate revisions, and how much the market has already paid. Memory wins on fundamentals - ...

Everyone is watching AI chipmakers, but the real battle may be unfolding in memory, and SK Hynix is leading the charge.

This voice experience is generated by AI. Learn more. This voice experience is generated by AI. Learn more. The 2026 IEEE Hot Chips Conference, marked by record attendance, underscored the critical ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

Samsung Electronics showcased its next-generation 3D memory architectures at the Future of Memory and Storage 2026 in California on Tuesday ...

Use left and right arrow keys to seek audio. Rambus has provided more details on its upcoming HBM4 memory controller, which offers some huge upgrades over current HBM3 and HBM3 memory controllers.