Volume production slips to 2028, but early customer designs signal the interest Intel desperately needs to survive.
MEMS micromirror research hit a milestone as Penn State engineers built a single penny-sized chip that steers and refocuses a ...
The 650V GaN FET family targets high-efficiency power conversion for AI data centers, computing, industrial and critical ...
CXMT HBM3E is now in qualification testing at Alibaba T-Head and Cambricon Technologies, arriving a year earlier than the ...
Rep. Go Dong-jin’s August 31 bill would raise the minimum espionage sentence from 3 to 10 years and explicitly cover foreign ...
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced that it is actively ...
Product configuration makes it possible for electronics manufacturers to offer different product variants without engineering ...
Researchers have demonstrated that rotary ultrasonic machining can drill high-quality holes in single-crystal silicon by modifying the material ...
In November 2025, Navitas and GF announced a long-term strategic partnership to accelerate U.S. GaN innovation and domestic manufacturing. Navitas developed its Gen 5 GaNFast FETs and power integrated ...
The future of AI chips is increasingly being shaped by packaging // With its HiPIMS product line, TRUMPF is addressing a key challenge facing the semiconductor industry: the reliable coating of highly ...
As fabs become harder and costlier to build, advanced packaging could give India a faster route into the global semiconductor race.
From silica-rich sand to a finished chip inside a computer or mobile phone, semiconductor manufacturing involves a long chain of highly precise processes.
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