Solving High-Current Connectivity Challenges in Data Centre Cooling As data centre power densities increase, cooling ...

New cooling technologies are emerging as electric drivetrains, AI processors, and autonomous systems push automotive heat ...

OpenAI revealed first benchmarks for its Jalapeño ASIC, showing up to 1.9× perf/W gains over existing hardware for LLM ...

NVMe 2.4 updates 11 base specs, adding post-quantum cryptography, advanced power monitoring, and subsystem migration for AI ...

MIT uses laser pulses and ultrafast X-rays to map microscopic heat flow in multilayer semiconductors, exposing hidden defect ...

Hyderabad, India–based Advanced System in Package (ASIP) Technologies has begun construction of an outsourced semiconductor assembly and test (OSAT) facility in Visakhapatnam, Andhra Pradesh, with ...

Many companies are still unfamiliar with the EU Cyber Resilience Act (CRA), and even among those that are aware of it, there are significant misconceptions about both its scope and the amount of work ...

TSMC’s difficulty stitching together AI accelerators with high-bandwidth memory (HBM) on a single chip gives Intel a chance to win foundry customers, according to Counterpoint Research co-founder Neil ...

In real-world edge AI systems, the AI model is only one part of the design. A device must also sense its environment, process information locally, connect reliably, protect data, and respond at the ...

Agentic AI is reshaping semiconductor engineering. Much of the industry’s attention has focused on AI’s ability to generate RTL, automate coding tasks, or improve verification coverage. Those are ...