Kulicke & Soffa expands advanced packaging capabilities as co-packaged optics drives demand for higher-density heterogeneous ...

TI's TCAN6062 enables higher-bandwidth CAN XL networks, combining 2,048-byte payloads, 20Mbps data rates and backward ...

Sirin Software expands Infineon-based engineering support spanning wireless connectivity, industrial control, security and ...

DEEPX sees open software, portable models and ultra-low-power inference as critical to scaling physical AI beyond centralized ...

SEMI and Silicon Catalyst partner to connect semiconductor startups with investors, manufacturers, and technology leaders ...

Sensor fusion merges multi-sensor data with real-time AI, boosting drone navigation accuracy and anti-drone detection in harsh conditions.

New research institute will combine soft X-ray capabilities, information science and industrial expertise to advance ...

The new joint venture combines Sony's sensor expertise and TSMC manufacturing capacity to target emerging imaging markets.

GigaDevice partners with Rutronik to expand access to GD32 MCUs, sensors and analog solutions across key markets.

SEMCO raises MLCC prices amid stronger AI demand, tightening supply and rising utilization across Taiwanese and Chinese ...

Kioxia and Sandisk plan more than $31 billion in Japanese investments through 2032, targeting advanced NAND production and ...

Acquisition adds low-power analog and mixed-signal capabilities as semiconductor complexity drives higher automated test demand.