Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging ...

Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks ...

The most consequential figures on HPE's fiscal third-quarter earnings call on September 2 were not the results but the ...

BYD Semiconductor has begun mass production of a new automotive-grade 4D millimetre-wave radar chip built around its Xuanji ...

Broadcom used its third-quarter fiscal 2026 earnings call on September 2 to convert a quarter-by-quarter AI story into a ...

AI infrastructure expansion is accelerating demand for 800G and 1.6T optical modules, lifting first-half 2026 results across ...

As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal ...

Hewlett Packard Enterprise's fiscal third-quarter results, reported on September 2, are the point at which the Juniper ...

US Commerce Secretary Howard Lutnick has confirmed that the Trump administration is preparing a new round of semiconductor ...

Taiwanese compound semiconductor maker WIN Semiconductors said on September 1, 2026, that compound semiconductors are the ...

Shanghai UniVista Industrial Software Group has launched an Agentic EDA framework, a native 3DIC physical-design tool and an ...

South Korean prosecutors allege that Chinese memory maker ChangXin Memory Technologies (CXMT) set up an internal ...