IC ecosystem; UPF 4.0; AI readiness; auto, industrial chiplet SW; PCIe 6; 3D thermal analysis; rad-hard simulation.

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

With each iteration, PCIe has not only increased data bandwidth but also introduced innovations aimed at enhancing power efficiency—a critical factor in today’s energy-conscious computing environment.

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Key applications for GenAI and the features they enable, as well as an examination of how model growth and differing model ...

Create a hybrid digital twin with data and physics.

A new technical paper titled “Generative AI for Analog Integrated Circuit Design: Methodologies and Applications” was published by researchers at McMaster University. Abstract “Electronic Design ...

A new technical paper titled “The 2D Materials Roadmap” was published by researchers at many institutions including Chinese ...