Pioneering work in developing CFET-critical modules: an improved backside contact module and a novel gate stack for threshold ...
Researchers from the Massachusetts Institute of Technology (MIT), Georgia Tech, and Penn State University embedded gallium ...
Cassie Sheng is an R&D process integration engineer at imec, Belgium, where she has been working since 2023. She received her ...
We trust designers to do the best they can, but know they cannot be perfect. That's why we verify. When AI gets involved, it ...
Thermal drift, stress, electromagnetic coupling, and verification gaps are turning optical integration into a full-system co-design problem rather than a plug-in bandwidth upgrade.
Researchers at the University of Oxford published a technical paper titled “Hardware-Managed Heterogeneous High-Bandwidth ...
Researchers from Purdue University published a technical paper titled “Architecting the Next Generation of Asynchronous, ...
Researchers from TU Wien and Silvaco Europe published a technical paper titled “The influence of implantation conditions on ...
Researchers at UiT The Arctic University of Norway and Stanford University published a technical paper titled “Intracavity ...
Researchers from University of Alberta published a technical paper titled “PPAPlace: Differentiable Cross-Stage Objectives ...
Researchers from Georgia Institute of Technology published a technical paper titled “Thermal Tuning Overhead in Wafer-Scale ...
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