In modern AI data centers and Edge computing environments, high power densities and integration levels are mandatory requirements. To meet the demand for efficient power management solutions, ...

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Power GaN, Modernized Rectification, and Giuseppe Crippa’s Tribute!

The GaN manufacturing landscape is seeing continual shifts over time. The power gallium nitride (GaN) manufacturing landscape is seeing continual shifts over time. As technology reaches more greater ...

The DK5V100R15S from Shenzhen DongKe Semiconductor provides a compelling and drop-in alternative to Schottky rectifiers.

NXP Semiconductors has introduced the BMx7318/7518, a new family of 18-channel lithium-ion battery cell controller ICs, developed to serve high-voltage battery management systems (HVBMS) for electric ...

In this PowerUp CircuitLab episode, we explore current measurement techniques on a hair dryer with both resistive and inductive components. From invasive methods like ammeters and shunt resistors to ...

Electric motors are the beating heart of sustainable mobility. They play a fundamental role in transforming the automotive industry and beyond. With the increasing adoption of EVs and a growing focus ...

Power Electronics News Explores Wireless Power Transfer, Common Applications, and The Technology That Makes Energy Transfer Possible.

In this article we discuss an analysis of root cause failure mechanisms reported by Efficient Power Conversion (EPC), a manufacturer of GaN power devices, from drain and gate over-voltage stresses on ...

The step-down (buck) In DC/DC switching circuits, appropriately driven electronic switches and components are used to store energy, allowing it to be converted. A step-down, or buck, converter is a DC ...

Previous section: Power Supply Design Tutorial, Part 2 In Part 2-1 of our Power Supply Design Tutorial we’re going to start a deep-dive into the buck converter and select one very important part, the ...

During the 2023 IEEE International Electron Devices Meeting (IEDM), Intel researchers presented progress in 3D stacked CMOS transistors, which incorporate backside-power and direct-backside ...