Scale-up optics will be decided by the link budget. The largest recoverable losses sit at the connector and inside the ...

TLS360™ is Rochester Electronics’ lifecycle assurance program, extending select mission-critical semiconductors beyond EOL ...

Join this webinar and discover how modern vehicles are evolving into software-centric platforms that can be continuously updated.

SUSE targets sovereign AI via architectural choice, enabling enterprises to pivot between Nvidia and AMD silicon without ...

AI is turning chip patents into a geopolitical battle for dominance, from Nvidia’s CUDA moat to China’s filing surge.

New cooling technologies are emerging as electric drivetrains, AI processors, and autonomous systems push automotive heat ...

Solving High-Current Connectivity Challenges in Data Centre Cooling As data centre power densities increase, cooling ...

OpenAI revealed first benchmarks for its Jalapeño ASIC, showing up to 1.9× perf/W gains over existing hardware for LLM ...

NVMe 2.4 updates 11 base specs, adding post-quantum cryptography, advanced power monitoring, and subsystem migration for AI ...

Qualcomm’s Modular buyout targets cross-chip portability across Nvidia, AMD, and its own AI hardware to break the software ...

MIT uses laser pulses and ultrafast X-rays to map microscopic heat flow in multilayer semiconductors, exposing hidden defect ...

SK Hynix’s $4 billion Indiana advanced packaging fab aims to secure U.S. HBM production and address critical chip supply chain gaps.