ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...

New Delhi, May 20, 2024 (GLOBE NEWSWIRE) -- The global wafer dicing services market stood at US$ 578.8 million in 2023. It is expected to reach US$ 838.9 million by 2032, growing at a moderate CAGR of ...

TORONTO, Aug. 12, 2025 /PRNewswire/ - Xanadu, the leading photonic quantum computing company, and DISCO Corporation, renowned precision machine and processing tool manufacturer, are developing ...

ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has ...

LONDON--(BUSINESS WIRE)--Technavio’s latest market research report on the global wafer dicing saws market provides an analysis of the most important trends expected to impact the market outlook from ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...

(MENAFN- EIN Presswire) Rest of Asia-Pacific segment contributed the major share in the thin wafer processing and dicing equipment market in 2021. The thin wafer processing and dicing equipment market ...

The rise in consumer electronics demand and the trend toward smaller electronic devices and the surge in demand for thinner wafers and more robust chips across the world drive the growth of the global ...