ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...

TORONTO, Aug. 12, 2025 /CNW/ - Xanadu, the leading photonic quantum computing company, and DISCO Corporation, renowned precision machine and processing tool manufacturer, are developing advanced wafer ...

Swindon-based Loadpoint is to develop techniques and equipment for manufacturing next-generation 0.10µm integrated circuits. “We are looking at the requirements of dicing chip-scale packages from ...

ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has ...

New Delhi, May 20, 2024 (GLOBE NEWSWIRE) -- The global wafer dicing services market stood at US$ 578.8 million in 2023. It is expected to reach US$ 838.9 million by 2032, growing at a moderate CAGR of ...

LONDON--(BUSINESS WIRE)--Technavio’s latest market research report on the global wafer dicing saws market provides an analysis of the most important trends expected to impact the market outlook from ...

By wafer size, the 5-inch and 6-inch segment accounted for nearly two-thirds of the global thin wafer processing and dicing equipment market share in 2021, and is projected to retain its dominance by ...