It delivers lead-free deposits that exhibit excellent brightness and solderability over the wide current density and temperature ranges. The process targets connectors and other microelectronics ...

This file type includes high resolution graphics and schematics when applicable. Tin whiskers are slim metallic filaments that emanate from the surface of tin platings (see the figure). These ...

DuPont de Nemours, Inc. DD recently launched SOLDERON BP TS 7000, the latest innovation in tin-silver plating chemistry, at the IEEE Electronic Components and Technology Conference (ECTC), in Orlando, ...

The tin whisker phenomenon is a failure mode associated with all electronic devices that use a number of low melting-point elements (e.g., Sn, Cd, In) in operations such as soldering. Recognized many ...

The electroplating intermediate is a material used in the electroplating process to adjust characteristics such as grain size, gloss, thickness and plating speed. Most of them are configured as ...

The tin whisker phenomenon is a failure mode associated with a number of plated low-melting-point elements (tin, cadmium, and indium) used to promote good soldering. Recognized many years ago, the ...

Copper bus bars are commonly used instead of wire for carrying high currents. [Dane] needed some bus bars for a project, but he was worried about corrosion. His solution was tin electroplating the bus ...