Business Wire

OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...
Morningstar

WeTouch Achieves Breakthrough in Curved Touch and Optical Bonding Technology, Enabling Full Mass Production up to 86 Inches

First Batch of Curved Touch Products Enters Small-Scale Deliveries, Expected to Generate up to USD 5 Million in Additional Revenue in 2026 CHENGDU, CN / ACCESS Newswire / August 25, 2025 / WeTouch ...
Nasdaq

OKI and NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

- Aiming for mass production in FY2026 for real-world implementation in the fields of 6G communications and non-destructive sensing- Terahertz waves are electromagnetic waves in the range between ...
Seeking Alpha

OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers

- Contributing to the advancement of photonics-electronics convergence technology and working with partners for early commercialization - TOKYO--(BUSINESS WIRE)-- OKI (TOKYO: 6703) has successfully ...