Kandou AI Inc., a developer of copper-based interconnects for artificial intelligence chips, has raised $225 million in ...

'If there's not a road map, it wouldn't make sense to commit down Omni-Path's route. It's a one-trick pony, so to speak,' said one Intel partner of the chipmaker's decision to cancel a ...

SEALSQ Corp (NASDAQ:LAES) is one of the popular penny stocks on Robinhood to buy. On March 24, SEALSQ Corp (NASDAQ:LAES) ...

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems ...

Strategic Acquisition via the SEALSQ Quantum Fund Strengthens its Quantum Vertical Stack . SEALSQ Corp (NASDAQ: LAES) (“S ...

Enhancements to Keysight's AresONE 1600GE and INPT-1600GE test platforms now expand 1.6T Ethernet interconnect validation to ...

Infraeo to showcase award-winning 1.6T and 800G AI interconnect technologies at OFC 2026, featuring Lightwave Innovation Awards recognition and live demonstrations with Marvell and Intel. ROUND ROCK, ...

Hyper Photonix, today announced a live demonstration of its next-generation 1.6 Tbps optical transceiver operating over 4-core multicore fiber (MCF) at the Optical Fiber Communication Conference (OFC) ...

Ayar Labs Inc., a startup that’s developing optical interconnects that can transmit data between computer chips via light, said today it has closed on a hefty late-stage $155 million funding round led ...

One of the unsung workhorses of modern technology is the humble interconnect. This is essentially a wire or set of wires that link one part of an electronic system to another. In ordinary silicon ...

At embedded world 2026, Electronic Specifier Editor Mick Elliott speaks with Pierre Cardinal, Regional Sales Manager at ...

The high functional integration of system-on-chip designs today is driving the need for new technological approaches in semiconductor design. Anyone who owns a Samsung Galaxy S4, HTC One or comparable ...