Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...

Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...

Chip design companies and package assembly houses have no unified signoff verification process to ensure that an IC package meets manufacturability and performance requirements. Packages need a ...

Power Delivery Network (PDN) has traditionally been a disjointed design problem with chip, package and board engineers doing their part of the design with margins assumed for the other parts. As 45nm ...