Covered, the digital insurance agency serving mortgage institutions nationwide, announced today the expansion of its embedded ...

Modern businesses use various technology solutions, but not all of them are identical. Disparate applications do not interact with each other by default and require API integrations. These ...

SAN FRANCISCO — Intel gave further details on its technique for embedding spin-transfer torque (STT)-MRAM into devices using its 22-nm FinFET process, pronouncing the technology ready for high-volume ...

The past several years have seen financial services embedded into a wide variety of software and applications peddled by non-bank providers. This trend is widely referred to as embedded finance and it ...

As the global aerospace and defense industry shifts into the 2020s, embedded systems suppliers are being tasked with supporting certifiable avionics architectures capable of meeting the most stringent ...

USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions.

LONDON--(BUSINESS WIRE)--The embedded software market is expected to grow by USD 5.69 billion during 2020-2024, expanding at a CAGR of over 6%. The report also provides the market impact and new ...

It seems a new memory technology is needed to shrink MCUs and SoCs without redesigning the memory system and keep costs in check. It’s expected that, over the next decade, an emerging memory (PCM?

The nature of embedded systems is being changed with the advent of graphical, intelligent human-machine interfaces and the Internet of Things. Every imaginable system, from coffee makers and washing ...

Manual processes and legacy systems have weighed down the logistics industry for decades. Moreover, point solutions only serve a specific purpose but fail to provide a holistic overview by hindering ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...