Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Heterogeneous integration technology refers to the integration of separately manufactured components into a higher-level assembly, or system in package (SiP), that in the aggregate, provides enhanced ...

The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies ...