When it comes to FDM 3D prints and making them stronger, most of the focus is on the outer walls and factors like their layer adhesion. However, paying some attention to the often-ignored insides of a ...
Finite Element Analysis (FEA) has emerged as an indispensable tool in the study and design of power cables and submarine cable systems. By subdividing complex cable assemblies into discrete, ...
A team of researchers, including Insigneo member Professor Damien Lacroix from the University of Sheffield’s Department of Mechanical Engineering, have published a paper in Frontiers in Surgery.
In 2001, IBM patented a method of using a double bump material structure to make a reliable joint between a chip and its package for bump pitch below 150 µm. 1 This invention improved the existing ...
In advanced engineering circles, the finite element method — or, more commonly, finite element analysis — is a real staple. With the advent of more powerful home computers, though, even your home ...
The miniaturization trend in electronic devices and the rise in smart and IoT device segments make adopting heterogeneous integration of chip components or 3D-ICs a viable option for miniaturization ...
They simulate post-op outcomes and predict how the implant, bone and soft tissues will interact. Read more at ...
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